OVIs by Dynamic Headspace and Gerstel MACH on Rtx-WAX (G16)

PeaksConcentration
(µg added)
1.Methanol6.00
2.Acetonitrile0.82
3.Dichloromethane1.20
4.trans-1,2-Dichloroethylene1.88
5.Hexane0.58
6.cis-1,2-Dichloroethylene1.88
7.Nitromethane0.10
8.Tetrahydrofuran1.38
9.Chloroform0.12
10.Cyclohexane7.76
11.1,2-Dimethoxyethane0.20
PeaksConcentration
(µg added)
12.Trichloroethylene0.16
13.Methylcyclohexane2.36
14.1,4-Dioxane0.76
15.Pyridine0.40
16.Toluene1.78
17.2-Hexanone0.10
18.Chlorobenzene0.72
19.Ethyl benzene0.74
20.m-Xylene2.60
21.p-Xylene0.61
22.o-Xylene0.39
23.Tetralin0.20
* septum components
image
GC_PH00846
ColumnsRtx®-WAX (G16) 20 m, 0.18 mm ID, 0.4 µm,
using IP Deactivated Guard Column 5 m, 0.32 mm ID (cat.# 10044)
with Universal “Y” Press-Tight Connector (cat.# 20405)
SampleResidual Solvents Class 2 - Mix A (cat.# 36271)
Residual Solvents Class 2 - Mix B (cat.# 36272)
Diluent:0.5mL DI water/~0.2g sodium sulfate in 20mL headspace vial
Injectionheadspace-trap split (split ratio 20:1)
Headspace-Trap
Instrument:Tekmar HT3
Inj. Temp.:220 °C
Transfer Line Temp.:220 °C
Valve Oven Temp.:220 °C
Oven Temp.:250 °C
Standby flow rate:50 mL/min
Trap Standby Temp:40 °C
Trap Sweep Temp:40 °C
Preheat Mixer:On
Preheat Mixer Time:2.00 min
Preheat Mixing Level:5
Preheat Mixer Stabilize Time:0.50 min
Sample Temp.:80 °C
Sample Equil. Time:15.00 min
Sweep Flow Rate:75 mL/min
Sweep Flow Time:5.00 min
Dry Purge: 10.00 min, flow 100 mL/min @ 25 °C
Desorb Preheat Temp:245 °C
Desorb: 1.00 min @ 250 °C
Trap Bake Temp:260 °C
Trap Bake Time:6.00 min
Trap Bake Flow:450 mL/min
Oven
Oven Temp.:250 °C
Carrier GasHe, constant flow
Flow Rate:0.99 mL/min
DetectorFID @ 250 °C
Make-up Gas Flow Rate:45 mL/min
InstrumentAgilent/HP6890 GC
NotesGerstel Modular Accelerated Column Heater (MACH): 35°C (2 min.) to 60°C at 100°C/min. (hold 1 min.), to 200°C at 40°C/min. (hold 2 min.)
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